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AmbiDeck® 20 Pro
Low-Profile System

AmbiDeck® 20 Pro
Low-Profile System

AmbiDeck 20 Pro - #1

AmbiDeck® 20 Pro

AmbiDeck® 20 Pro is a high‑performance, low‑profile underfloor heating (UFH) system designed for retrofit projects where floor build‑up must be kept to an absolute minimum. At just 20mm thick, the AmbiDeck 20 Pro panels incorporate high‑density XPS insulation and a cement‑coated, tile‑ready surface, enabling direct tiling without the need for additional boards. Its high-thermal material and unique lozenge‑shaped design increases heat output by +50% compared with standard boards, improving coverage and delivering exceptional performance.

The system accommodates 16mm UFH pipe within precision‑cut channels, including a built‑in 150mm radius return, and allows easy routing of additional channels on site where required. AmbiDeck® 20 Pro is tested to BS EN 1264‑2:2021 and is suitable for both concrete and timber subfloors, provided the base is flat, clean and level. Panels may be adhered or mechanically fixed depending on the substrate.

Because tiling can be applied directly over the AmbiDeck® 20 Pro surface, the system is ideal for bathrooms, kitchens and high‑performance retrofit applications where thermal responsiveness and robust floor coverings are essential. For carpet, vinyl or wooden floors, a minimum of 6mm levelling compound should be used.

 

Why Choose AmbiDeck® 20 Pro?

  • Exceptionally High Output: Up to 120 W/m² at 45°C MWT and 20°C room temperature (0 tog/tile).
  • Direct‑Tile Surface: Cement‑coated face allows tiles to be installed directly after priming.
  • 20mm Low‑Profile Build‑Up: Minimises floor height increase in retrofit scenarios.
  • Lozenge‑Shaped Board Design: Provides +10% output and improved heat distribution as levelling compound surrounds the pipe.
  • High Thermal Performance: XPS insulation with 0.031 W/mK conductivity and rigid cement‑coated surface for stability.
  • Flexible Installation: Suitable for both concrete and timber subfloors; adhere with flexible tile adhesive or DeckBond spray adhesive, or screw (timber).
  • Three Panel Types: Universal, Highway, and Corner panels for full layout flexibility.

System Components & Build‑Up

This engineered assembly creates a high‑efficiency, load‑stable and tile‑ready UFH system suitable for both domestic and light‑commercial applications.

Thermal Performance
Tested to BS EN 1264‑2:2021, AmbiDeck® 20 Pro achieves up to 120 W/m² at 20°C room temperature with MWT 45°C and 0 tog covering. Performance will vary depending on covering type, pipe centres and building heat‑loss characteristics.

Floor Finishes

  • Tiles: Lay directly after priming panels; fill joints with flexible adhesive.
  • Carpet / Vinyl / Wood: Apply minimum 6mm levelling compound before installation.
  • LVT: As per vinyl installation – requires levelling layer for smooth finish.

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Benefits of the AmbiDeck® 20 Pro System

Low-profile build-up

Low-profile build-up

20mm construction suited for projects with limited floor height

Tile over directly

Tile over directly

Suitable for tiled finishes without additional overlay boards

High thermal insulation

High thermal insulation

+10% thermal value over traditional AmbiDeck® models

Corrects uneven subfloors

Corrects uneven subfloors

Suitable for use over uneven subfloors

AmbiDeck® 20 Pro Specification
Specification Value
System Type Low-profile
Subfloor Solid and suspended
Output (W/m²) 120 W/m² (based on 20°C room temperature at 45°C mean water temperature and 0 tog)
Pipe Size (mm) 16mm
Pipe Centres (mm) 150mm
Panel Size (mm) Universal panel (1200mm x 600mm x 20mm). Highway panel (1200mm x 600mm x 20mm). CornerBoard panel (1200mm x 600mm x 20mm).
Floor build up (excluding floor finishes) 20mm
Compressive Strength (kPa) 300 kPa
Thermal Conductivity (W/m²k) 0.031 W/mK
Maximum loop coverage: Up to 18m² per loop
Heatpump ready Yes
Weight (kg/m²) 15 kg/m² (includes board and pipe)
UK Patent Pending 2402953.0

AmbiDeck® 20 Pro FAQs

Why does AmbiDeck® 20 Pro deliver higher output than other systems?

Its high thermal material and unique lozenge shaped design improves heat transfer by allowing levelling compound to envelop the pipe, increasing output by a further 50% over other standard board designs.

Can AmbiDeck® 20 Pro be tiled directly?

What finishes require a levelling compound?

What adhesive is compatible (or not) with the panels?

Installing the AmbiDeck® 20 Pro System

Step 1. Ensure the working area is swept, clean and stable. Prime concrete surfaces to improve adhesion before laying the system.

Step 2. Spread an even bed of flexible tiling adhesive over the area before laying the AmbiDeck® 20 Pro panels. For timber subfloors, mechanically fix each board using AmbiDeck® Screws and Washers (12 fixings per board).

Step 3. Install the AmbiDeck® 20 Pro panels across the full area, ensuring the radius returns are positioned correctly at room edges. Allow the adhesive to fully dry before proceeding.

Step 4. Fit the UFH pipework into the channels in the AmbiDeck® 20 Pro panels, following the pipe layout shown on the supplied UFH design drawing.

Step 5. Tiling can be installed directly – prime the boards and fill any gaps with flexible tile adhesive. For carpet, vinyl or wood flooring, apply a minimum 6 mm levelling compound over the AmbiDeck® 20 Pro system before laying the final finish.

Why Choose Ambiente?

5-Year System Warranty

A unified 5-year warranty covering all critical UFH components when installed with Ambiente products, giving you and your customers complete peace of mind.

Manufacturing You Can Trust

Designed and manufactured in-house with installer experience at the core, our systems are built for long-lasting performance and reliability you can depend on.

Bespoke Heating Design

Full CAD design service including pipe layouts, heat outputs and flow rates, tailored to your project so the system delivers optimal comfort every time.

Product Technical Support

Access expert technical support throughout specification, installation and aftercare - so you always have the answers when you need them.

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